Galvanoplàstia petita o profunda forat coure xapat electricitat calefacció tubs

Galvanoplàstia petita o profunda forat coure xapat electricitat calefacció tubs

A addició a el bàsic preparació mètode, el pràcticitat de addició additius en en galvanoplàstia depèn enterament on els additius, especialment per alta dificultat taulers tal as petit i profund porus. Generalment, additius can be dividit into brighteners, leveling agents, carrier agents, fine-grained agents, and wetting agents. El teòric base de aquests additius és no encara madur, i most de ells venir de continus experimentals resultats, so ells són gairebé enterament dins el abast de comercialització, i la seva referència fonts són majoritàriament diversos patents, Però gairebé tot de els productes publicats són obsolets i no més llargs primers, i most de ells són actualment en el mercat

De diversos dades, it can be seen that the micro distribution force of copper sulfate plating solution is very good, that can first fill in small scratches and dents on the surface to be plated, and then fully plated. Tanmateix, per el porus mur de PTH, en ordre a palanquejament els avantatges de aquesta micro distribució, it és necessària per contínuament flux en alta concentració xapat solució i reduir el gruix de el càtode pel·lícula, que és el primari condició per el sits avantatges

2, Discussió on Coure Revestiment per per Petit o Profund Forats

The assembly of circuit boards is becoming increasingly tight, with the benefits of reducing the volume of the final product and increasing the capacity and speed of information processing. Especially since the large-scale development of VLSI, the assembly of ICs on boards has gradually improved from early through-hole insertion to surface adhesive SMT. For boards, thin lines and small holes are inevitable problems to face. As for small holes, the biggest impact is on existing copper plating technology. When the aspect ratio of holes is very high, To obtain a 1mil thick pore wall without the occurrence of dog bone phenomenon, the various physical properties of the surface and coating must pass existing standards, and there are many difficulties that need to be overcome. The industry in various countries is currently working on basic formulas, additives, equipment, and other aspects, but there are still few significant breakthroughs. The difficulty of plating small holes is now discussed as follows. The physical part is much larger than the aperture part, Almost all the strong water flow is wasted on the obstruction of the board surface. One solution is to increase the copper concentration in the liquid or reduce the number of passes, but this is also a dead end, as the copper content of 2oz/gal is almost the upper limit of the uniform coating ratio between the board surface and the hole wall. If it is further increased, the dog bone will become serious, The second solution is to improve the physical properties of the chemical copper coating to meet the standard requirements. Currently, Hitachi's TAF II process has been studied for several years

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